联系我们
主办单位

浙江省人工智能学会

高登会展集团

承办单位

上海大道国服展览有限公司

联系我们
快速连接
首页 > 展会概况 > 展会概况

2026杭州国际数据中心液冷产业大会暨展览会

 主题:智算赋能新基建绿色低碳双碳行

2026 Hangzhou International Data Center Liquid Cooling Industry Conference & Exhibition

Theme: Intelligent Computing Empowers New Infrastructure · Green and Low-Carbon Path to Dual Carbon Goals

 

展览时间:20261022-24

展览地点:杭州大会展中心-浙江

Exhibition Dates: October 22–24, 2026

Venue: Hangzhou Grand Convention and Exhibition Center, Zhejiang

 

 

展会概况

数字经济浪潮奔涌,算力基建赋能未来!为抢抓“十五五”开局与“数据要素 ×”三年行动计划收官的战略机遇,助力数据中心产业绿色化、智能化、高效化升级,我们诚挚邀请您莅临高登会展联合相关行业组织定于20261022-24日在杭州大会展中心举办的“2026杭州国际数据中心液冷产业大会暨展览会”。本届展会立足杭州数字经济核心城市优势,联动长三角产业生态,汇聚全球顶尖技术、产品与资源,打造集展示、交流、合作、采购于一体的国际级数据中心产业盛会,诚邀您拨冗莅临,共探行业新趋势、共商发展新机遇。本届博览会以“智能、绿色、高效、创新”为核心导向,深度契合AI算力爆发、双碳政策落地、数据中心高质量发展的行业趋势。展会总规划展出面积30000平方米,预计吸引400国内外优质展商参展,汇聚20000人次专业观众,覆盖数据中心全产业链条。依托浙江省 “数字经济创新提质” 政策支持与杭州数字经济产业集群优势,展会将聚焦数据中心基础设施、绿色节能技术、AI 算力融合、数字化运维、数据安全等核心领域,搭建供需精准对接、技术交流碰撞、产业生态协同的一站式平台,推动前沿技术成果转化,助力企业拓展市场、提升品牌影响力,为数字经济高质量发展筑牢算力根基。

Exhibition Overview

The wave of the digital economy is surging, and computing power infrastructure is empowering the future! To seize the strategic opportunities presented by the launch of the "15th Five-Year Plan" and the conclusion of the "Data Element ×" Three-Year Action Plan, and to facilitate the green, intelligent, and efficient upgrade of the data center industry, we cordially invite you to the "2026 Hangzhou International Data Center Liquid Cooling Industry Conference & Exhibition."

 

Jointly organized by Shanghai Golden Conference & Exhibition Group Co., Ltd. and relevant industry associations, this event will be held from October 22-24, 2026, at the Hangzhou Grand Convention and Exhibition Center. Leveraging Hangzhou's position as a core city for the digital economy and linking the industrial ecosystem of the Yangtze River Delta, this exhibition gathers top global technologies, products, and resources. It serves as an international-level data center industry event integrating display, exchange, cooperation, and procurement.

 

We sincerely invite you to attend, explore new industry trends, and discuss new opportunities for development. Guided by the core principles of "Intelligent, Green, Efficient, and Innovative," this expo deeply aligns with industry trends such as the explosion of AI computing power, the implementation of dual-carbon policies, and the high-quality development of data centers.

 

The total planned exhibition area is 30,000 square meters, expecting to attract 400 high-quality domestic and international exhibitors and 20,000 professional visitors, covering the entire data center industry chain. Supported by Zhejiang Province's "Digital Economy Innovation and Quality Improvement" policies and Hangzhou's digital economy cluster advantages, the expo will focus on core areas including data center infrastructure, green energy-saving technologies, AI computing integration, digital O&M, and data security. It establishes a one-stop platform for precise supply-demand matching, technical exchange, and industrial ecosystem collaboration, promoting the transformation of cutting-edge technologies and helping enterprises expand markets and enhance brand influence, thereby solidifying the computing foundation for high-quality digital economy development.

 

 

 

同期活动

展会同期将举办多场高规格论坛、研讨会及对接活动,汇聚院士专家、行业领袖、企业高管,共话产业热点、破解发展难题:

国际数据中心产业发展高峰论坛

聚焦全球数据中心政策导向、市场趋势、技术创新与碳中和路径,解读行业发展新方向。

AI 算力与液冷散热技术峰会

探讨 AI 智算中心高密散热需求、液冷技术规模化应用、算力与散热协同发展新路径。

数据中心绿色低碳与节能降耗论坛

围绕低 PUE 技术、可再生能源利用、储能融合、碳管理体系等议题,分享绿色实践方案。

数据中心数字化运维与安全管控论坛

聚焦智能运维、远程监控、自动化管理、数据安全、网络安全等技术应用。

供需对接会与新品发布会

组织展商与电信运营商、互联网巨头、金融、政府等核心采购方精准对接,支持企业举办新品首发、技术推介活动。

数据中心产业人才交流大会

搭建校企、企企人才对接平台,破解行业人才紧缺难题。

Concurrent Events

Multiple high-level forums, seminars, and matchmaking events will be held concurrently, gathering academicians, industry leaders, and corporate executives to discuss industry hotspots and solve development challenges:

 

International Data Center Industry Development Summit

Focusing on global data center policy direction, market trends, technological innovation, and carbon neutrality pathways.

 

AI Computing Power and Liquid Cooling Technology Summit

Exploring high-density cooling demands for AI intelligent computing centers, large-scale application of liquid cooling technology, and new paths for coordinated development of computing power and heat dissipation.

 

Data Center Green, Low-Carbon and Energy Saving Forum

Sharing green practice solutions around topics such as low PUE technology, renewable energy utilization, energy storage integration, and carbon management systems.

 

Data Center Digital O&M and Security Control Forum

Focusing on the application of technologies including intelligent O&M, remote monitoring, automated management, data security, and cybersecurity.

 

Supply-Demand Matchmaking & New Product Launch

Facilitating precise connections between exhibitors and core buyers such as telecom operators, internet giants, financial institutions, and government agencies. Supporting companies in hosting new product debuts and technology promotion events.

 

Data Center Industry Talent Exchange Conference

Building a platform for university-enterprise and inter-enterprise talent matching to address industry talent shortages.

 

展出大类

1. 算力核心设备与架构 

AI芯片/DPU/CPU /GPU、服务器、交换机、存储设备、网络设备、光模块/光通信、机柜、防火墙及网关、边缘计算芯片、边缘计算、超算中心/智算中心/边缘数据中心、云服务、物联网、算力安全、软件应用等。

 2. 算力服务 

智算中心、超算中心、云计算中心、通用数据中心。

 3. 绿色低碳基础设施 

3.1 液冷技术及产品

冷板式液冷、浸没式液冷、喷淋式液冷、CDU,单相液冷工质、两相液冷工质、干冷器、冷板、Manifold、快速接头、换热器、阀门、管道、水泵、传感器、漏液检测等。

液冷原料:包括冷却液、制冷剂、氟化液、硅油、矿物油 二氧化碳/氢、水溶液等;
液冷装置:冷板式液冷用品、金属冷板、发热设备及部件、液体循环设备浸没式液冷用品、散热器件、散热器、散热管风扇、冷却液、泵、压缩机、驱动环动力组件、温度控制组件、节温器/温控器、温度传感器、蒸发器、冷凝器、膨胀壶/冷却液罐等;
管路与连接件:胶管、金属管、波纹管、保温管、水管/ 头、冷却管路及连接各部件等;
辅助散热设备:散热风扇、散热材料、增强散热器、环境空气交换设备;
液冷核心技术与设备:包括冷板式液冷(含全液冷冷板服务器)浸设式液冷(单相/两相)、喷淋式液冷;冷模块解耦设计、智能温控系统、流体分配技术:关键零部件如冷却液(氟化液、矿物油等)、冷板、泵、阀门、快接头、换热器:漏液检测设备、智能传感器、相变材料(PCM);

3.2 供配电系统

UPS不间断电源、EPS应急电源、HVDC、飞轮UPS、储能系统、燃料电池及氢能发电系统、蓄电池、配电柜及电缆、PDU、发电机组及负载测试、母线及ATS、电能质量、智能配电相关产品。

3.3 制冷及新风系统

水冷式冷冻水机组、风冷式冷冻水机组、精密空调、冷却塔、水蓄冷、冰蓄冷、板式热交换器、水泵、管道及阀门、湿膜加湿器、配冷送风系统、排风及排水、新风系统。

3.4 消防与安防

消防系统、视频监控系统、门禁系统、入侵检测系统、报警平台。

3.5 数据中心管理

数据中心基础设施:数据中心基础设施解决方案、边缘数据中心方案、微模块数据中心、空调、制冷及新风系统、供配电系统、综合布线系统、机房建筑及装饰材料、大屏幕显示系统、消防系统、安防系统;

3.6 综合布线

铜览布线系统、光纤布线系统、网格桥架、走线架、光纤槽道、标识、机架及机柜。

3.7 其他

防雷、测试仪、大屏幕系统、防静电地板、防火封堵等。

 4. 相关服务 

规划咨询及设计、工程建设、竣工验收、评级认证、基础设施运维、IT服务及运维。

Exhibit Categories

1. Core Computing Equipment & Architecture

AI Chips/DPU/CPU/GPU, Servers, Switches, Storage Equipment, Network Equipment, Optical Modules/Communication, Cabinets, Firewalls & Gateways, Edge Computing Chips, Edge Computing, Supercomputing Centers/Intelligent Computing Centers/Edge Data Centers, Cloud Services, IoT, Computing Security, Software Applications, etc.

 

2. Computing Services

Intelligent Computing Centers, Supercomputing Centers, Cloud Computing Centers, General Data Centers.

 

3. Green & Low-Carbon Infrastructure

 

3.1 Liquid Cooling Technology & Products

 

Technologies: Cold Plate Liquid Cooling, Immersion Liquid Cooling, Spray Liquid Cooling, Coolant Distribution Units (CDU).

 

Components: Single-phase/two-phase liquid coolants, dry coolers, cold plates, manifolds, quick connectors, heat exchangers, valves, piping, pumps, sensors, leak detection systems.

 

Raw Materials: Cooling liquids, refrigerants, fluorinated fluids, silicone oil, mineral oil, CO₂/hydrogen, aqueous solutions.

 

Liquid Cooling Units: Cold plate components, metal cold plates, heat generating equipment, liquid circulation units, immersion cooling components, radiators, cooling fans, pumps, compressors, drive ring power assemblies, temperature control modules, thermostats, temperature sensors, evaporators, condensers, expansion tanks/coolant reservoirs.

 

Piping & Connectors: Hoses, metal pipes, corrugated pipes, insulated pipes, water pipes/connectors, cooling pipelines.

 

Auxiliary Cooling: Cooling fans, heat dissipation materials, enhanced radiators, ambient air exchange equipment.

 

Core Tech & Equipment: Cold plate liquid cooling (incl. full liquid-cooled cold plate servers), immersion liquid cooling (single-phase/two-phase), spray liquid cooling; cooling module decoupling design, intelligent temperature control systems, fluid distribution technology; key components such as coolants (fluorinated fluids, mineral oil, etc.), cold plates, pumps, valves, quick connectors, heat exchangers; leak detection equipment, intelligent sensors, phase change materials (PCM).

 

3.2 Power Supply & Distribution Systems

UPS Uninterruptible Power Supply, EPS Emergency Power Supply, HVDC, Flywheel UPS, Energy Storage Systems, Fuel Cells & Hydrogen Power Generation Systems, Batteries, Distribution Cabinets & Cables, PDU, Generator Sets & Load Testing, Busways & ATS, Power Quality, Intelligent Power Distribution Products.

 

3.3 Cooling & Ventilation Systems

Water-cooled Chillers, Air-cooled Chillers, Precision Air Conditioning, Cooling Towers, Water Storage, Ice Storage, Plate Heat Exchangers, Pumps, Pipes & Valves, Wet Film Humidifiers, Cold Air Distribution Systems, Exhaust & Drainage, Fresh Air Systems.

 

3.4 Fire Protection & Security

Fire Protection Systems, Video Surveillance Systems, Access Control Systems, Intrusion Detection Systems, Alarm Platforms.

 

3.5 Data Center Management & Infrastructure

Data center infrastructure solutions, edge data center solutions, micro-module data centers, air conditioning & ventilation systems, power supply & distribution systems, structured cabling systems, building and decorative materials, large-screen display systems, fire protection systems, security systems.

 

3.6 Structured Cabling

Copper Cabling Systems, Fiber Optic Cabling Systems, Grid Trays, Cable Runways, Fiber Ducts, Identification, Racks & Cabinets.

 

3.7 Miscellaneous

Lightning Protection, Test Instruments, Large Screen Systems, Anti-static Flooring, Firestop Systems.

 

4. Related Services

Planning Consultation & Design, Engineering Construction, Completion Acceptance, Rating Certification, Infrastructure O&M, IT Services & O&M.

 

目标观众

电信与互联网行业:电信运营商、移动/联通/电信、广电网络、互联网巨头、云服务商、IDC 运营商

金融与政企领域:银行、证券、保险等金融机构,政府部门、央国企、事业单位信息化部门

科技与制造领域:AI 企业、半导体厂商、服务器制造商、IT 设备商、新能源、智能制造企业

工程与设计领域:数据中心设计院、EPC 总包商、系统集成商、工程建设公司

科研与投资领域:高校、科研院所、行业协会、投资机构、产业园区

其他领域:医疗、教育、交通、物流、能源等行业数字化负责人、采购商、技术总监

Target Audience

 

Telecom & Internet Industry: Telecom operators (China Mobile, China Unicom, China Telecom), Broadcasting Networks, Internet Giants, Cloud Service Providers, IDC Operators.

 

Finance & Government: Banks, Securities, Insurance institutions; Government departments, Central SOEs, Public Institutions IT Departments.

 

Technology & Manufacturing: AI Enterprises, Semiconductor Manufacturers, Server Manufacturers, IT Equipment Vendors, New Energy, Intelligent Manufacturing Enterprises.

 

Engineering & Design: Data Center Design Institutes, EPC Contractors, System Integrators, Engineering Construction Companies.

 

R&D & Investment: Universities, Research Institutes, Industry Associations, Investment Institutions, Industrial Parks.

 

Other Sectors: Digitalization leaders, procurement officers, and technical directors from Healthcare, Education, Transportation, Logistics, and Energy sectors.

 

联系方式

电话:021-64396190

mailinfo@goldenexpo.com.cn

 

Contact Information

Tel: +86-21-64396190

E-mail: info@goldenexpo.com.cn